High Dielectric Constant Materials: VLSI MOSFET Applications: 16 Softcover reprint of hardcover 1st ed. 2005 Edition

High Dielectric Constant Materials: VLSI MOSFET Applications: 16 Softcover reprint of hardcover 1st ed. 2005 Edition book cover

High Dielectric Constant Materials: VLSI MOSFET Applications: 16 Softcover reprint of hardcover 1st ed. 2005 Edition

Author(s): Howard Huff (Editor), David Gilmer

  • Publisher: Springer
  • Publication Date: 21 Oct. 2010
  • Edition: Softcover reprint of hardcover 1st ed. 2005
  • Language: English
  • Print length: 734 pages
  • ISBN-10: 364205921X
  • ISBN-13: 9783642059216

Book Description

Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore’s Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Editorial Reviews

From the Back Cover

Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore’s Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

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