Wow! eBook
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging
Author(s): Jong-Hoon Lee (Author)
- Publisher: Morgan and Claypool Publishers
- Publication Date: 27 Feb. 2008
- Language: English
- Print length: 108 pages
- ISBN-10: 1598292447
- ISBN-13: 9781598292442
Book Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
