Wow! eBook
Thermal Management Handbook: For Electronic Assemblies
Author(s): Jerry E. Sergent (Author), Al Krum (Author), IMAPS (ISHM) (Author)
- Publisher: McGraw Hill
- Publication Date: 16 Jun. 1998
- Language: English
- Print length: 650 pages
- ISBN-10: 9780070266995
- ISBN-13: 9780070266995
Book Description
Publisher’s Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
The “hands-on” guide to thermal management!
In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges ― and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage ― and preventing thermal-related problems from occurring in the first place.
Editorial Reviews
From the Back Cover
Thermal Management Handbook.In recent years, heat-sensitive electronics systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges – and making thermal management a critical design factor. This timely handbook is the most current and comprehensive reference on the practical issues that any packaging engineer must consider with regard to the thermal management f printed circuit boards, hybrid circuits, and multichip modules. In addition to presenting and exploring the three basic issues at the core of effective thermal management – how and where the heat is generated; how the temperature at a given point in the circuit is determined; and how the heat is removed – the book is enhanced with tutorial chapters, data tables, and a wealth of design examples. Professionals will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design state – and preventing thermal-related problems from occurring in the first place.
