Reliability, Yield, and Stress Bu-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

Reliability, Yield, and Stress Bu-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development

by: Way Kuo – Taeho Kim – Wei-Ting Kary Chien

ISBN-10: 0792381076

ISBN-13: 9780792381075

Edition: 1998

Publication date: January 31, 1998

Hardcover: 394 pages
List Price $222.00