Reliability, Yield, and Stress Bu-In:A Unified Approach for Microelectronics Systems Manufacturing & Software Development
by: Way Kuo – Taeho Kim – Wei-Ting Kary Chien
ISBN-10: 0792381076
ISBN-13: 9780792381075
Edition: 1998
Publication date: January 31, 1998
Hardcover: 394 pages
List Price $222.00
未经允许不得转载：Wow! eBook » Reliability, Yield, and Stress Bu-In:A Unified Approach for Microelectronics Systems Manufacturing & Software Development