Development of Packaging and Products for Use in Microwave Ovens 2nd Edition
Author(s): Ulrich Erle (Editor), Peter Pesheck (Editor), Matthew Lorence (Editor)
Publisher: Woodhead Publishing
Publication Date: 31 May 2020
Edition: 2nd
Language: English
Print length: 590 pages
ISBN-10: 0081027133
ISBN-13: 9780081027134
Book Description
Development of Packaging and Products for Use in Microwave Ovens, Second Edition, supports the efficient design of microwaveable food products and packaging materials, explaining all essential aspects in a detailed and systematic way. This new edition reviews recent developments and the latest cutting-edge technology, including new materials and package formats, new ideas for product development, and new information on developments in microwave technology. Sections cover the effect of food dielectric properties and heating uniformity, microwave packaging materials, product development, food, packaging, oven safety, and the computer modelling of microwave products and active packaging.
Written by a distinguished team of international contributors, this book is not only a valuable resource for engineers, manufacturers and product developers in the food and packaging industries, but also a great research tool for industrial R&D and academia.
Enables the reader to understand product and packaging materials for microwave ovens down to a highly technical and detailed level
Offers systematic coverage on all aspects involved, including principles, materials, design, product development and modelling
Includes the very latest developments in products and packaging, including smart packaging and solid state technology
Editorial Reviews
Review
A comprehensive guide to the latest materials and technologies for microwaveable packaging and products
From the Back Cover
Development of Packaging and Products for Use in Microwave Ovens, Second Edition, supports the efficient design of microwaveable food products and packaging materials, explaining all essential aspects in a detailed and systematic way. This new edition reviews recent developments and the latest cutting-edge technology, including new materials and package formats, new ideas for product development, and new information on developments in microwave technology.
Part One discusses the principles of microwave heating and ovens, with an emphasis on the effect of food dielectric properties and heating uniformity. Microwave packaging materials and design are discussed in Part Two; chapters cover rigid packaging, susceptors, shielding and smart packaging. Part Three covers product development, food, packaging and oven safety, including new chapters on solid state technology and safety. Computer modelling of microwave products and active packaging are discussed in Part Four.
Written by a distinguished team of international contributors, Development of Packaging and Products for Use in Microwave Ovens 2nd Edition is a valuable resource for engineers, manufacturers and product developers in the food and packaging industries, alongside research both in industrial R&D and in academia.
About the Author
Ulrich Erle is an expert for cooking technologies and food science at the Nestlé Development Center in Solon/Ohio. During his assignments as project manager and senior scientific advisor he gained experience in the industrial application of microwaves in vacuum drying and sterilization processes. More recently, he concentrated on the performance of food products for household microwave ovens, including innovative packaging solutions. Ulrich is a member of the Board of Governors of the International Microwave Power Institute (IMPI) and also chaired the 50th IMPI Symposium in Orlando. He represents Nestlé in the Center for Advanced Processing and Packaging Studies (CAPPS) and in the RF Energy Alliance.
Peter Pesheck is currently Principal at Food Biophysics, LLC. In his 34-year R&D career at Pillsbury and General Mills he worked primarily in cross-business Strategic Technology groups, where he specialized in structure-function relationships, microscopy, modeling, microwave heating (food dielectric properties, simulation, product design and problem resolution), and wheat flour doughs and their structural transformations in proofing and baking. He has published 4 papers in reviewed journals and holds 19 U.S. patents.
Matthew Lorence is currently a Packaging Technology Manager at Bellisio Foods, Inc. He is a leader in the field of packaging R&D for consumer and industrial products, and medical devices. He was previously Packaging Technology Manager at General Mills. He holds 13 U.S. patents and has extensive experience in identifying, developing, and commercializing convenient Total Product Offerings leveraging Open Innovation for new packaging and product technologies.
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