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Advanced Flip Chip Packaging Softcover reprint of the original 1st ed. 2013 Edition
Author(s): Ho-Ming Tong (Editor), Yi-Shao Lai (Editor), C.P. Wong (Editor)
- Publisher: Springer
- Publication Date: 23 Aug. 2016
- Edition: Softcover reprint of the original 1st ed. 2013
- Language: English
- Print length: 567 pages
- ISBN-10: 1489979336
- ISBN-13: 9781489979339
Book Description
Advanced Flip Chip Packaging Softcover reprint of the original 1st ed. 2013 Edition presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Editorial Reviews
From the Back Cover
Advanced Flip Chip Packaging Softcover reprint of the original 1st ed. 2013 Edition presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book also:
- Offers broad-ranging chapters with a focus on IC-package-system integration
- Provides viewpoints from leading industry executives and experts
- Details state-of-the-art achievements in process technologies and scientific research
- Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information
Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
