Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Authors: Liu, Sheng; Liu, Yong; Liu, Yong
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Publisher: Wiley(2011/8/24)
Edition: 1
Language: English
ISBN-13: 9780470827802
e-ISBN-13: 9780470828410
未经允许不得转载：Wow! eBook » Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing