Modeling and Simulation for Microelectronic Packaging Assembly:Manufacturing, Reliability and Testing

Modeling and Simulation for Microelectronic Packaging Assembly:Manufacturing, Reliability and Testing

by: Liu, Sheng; Liu, Yong; Liu, Yong

Publisher: Wiley(2011/8/24)

Edition: 1

Language: English

ISBN-13: 9780470827802

e-ISBN-13: 9780470828410

未经允许不得转载：Wow! eBook » Modeling and Simulation for Microelectronic Packaging Assembly:Manufacturing, Reliability and Testing