Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing 2022年5月31日 25 阅读 0 评论 工程 Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing by: Liu, Sheng; Liu, Yong; Liu, Yong Publisher: Wiley(2011/8/24) Edition: 1 Language: English ISBN-13: 9780470827802 e-ISBN-13: 9780470828410 代发服务PDF电子书10元立即求助