Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology)

Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology)

Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology)

by: Navid Asadizanjani (Author), Himanandhan Reddy Kottur (Author), Hamed Dalir (Author)

Publisher: Springer

Publication Date: 2025-04-23

Language: English

Print Length: 202 pages

ISBN-10: 3031861019

ISBN-13: 9783031861017

Book Description

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Editorial Reviews

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Amazon Page

资源下载资源下载价格10立即购买
未经允许不得转载:Wow! eBook » Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology)