Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
by: Li, Er-Ping
Publisher: Wiley(2012/3/19)
Edition: 1
Language: English
ISBN-13: 9780470623466
e-ISBN-13: 9781118166741
未经允许不得转载：Wow! eBook » Electrical Modeling and Design for 3D System Integration:3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC