Advanced Electronic Packaging / Richard K. Ulrich

Editorial Reviews
Review
"…a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006)
"..offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)
"..an extremely thorough engineering textbook and an invaluable reference tool..get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)
"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)
Product Description
As in theFirst Edition, each chapter in this newSecond Editionis Author: ed Author: one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of theFirst Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
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