Solder Joint Reliability Prediction for Multiple Environment girro 2015年6月1日 14 阅读 0 评论 工程 Solder Joint Reliability Prediction for Multiple Environment by: Andrew E. Perkins, Suresh K. Sitaraman Print length: 192 Publication date: 2008-10-23 ISBN-10: 0387793933 ISBN-13: 9780387793931 代发服务PDF电子书10元立即求助
Contemporary Approaches in Material Science and Materials Processing Technologies: Selected, Peer Reviewed Papers from the 2nd International Conference on Materials Science and Engineering Technology (MSET 2015), April 25-26, 2015, Shanghai, China 2022年5月4日