Force Sensors for Microelectronic Packaging Applications (Mi girro 2015年6月1日 12 阅读 0 评论 工程 Force Sensors for Microelectronic Packaging Applications (Mi by: J. Schwizer, M. Mayer, O. Brand, Print length: 178 Publication date: 2004-11-23 代发服务PDF电子书10元立即求助
Advanced Materials Science and Technology, IFAMST 2008: Selected, Peer Reviewed Papers from the 6th Inteational Forum on Advanced Material Science and Technology (IFAMST 2008), 12-14 June 2008, the Hong Kong Polytechnic University, Hong Kong SAR, China 2015年4月6日