Characterization of Integrated Circuit Packaging Materials girro 2015年4月6日 12 阅读 0 评论 工程 Characterization of Integrated Circuit Packaging Materials by: Moore, Thomas Publisher: Elsevier Science ( 2013/10/22 ) ISBN-13: 9780750692670 ISBN-10: 0750692677 Language: English Category: Engineering: Electrical; Engineering 代发服务PDF电子书10元立即求助
Engineering Plasticity and Impact Dynamics: Proceedings of the Inteational Symposium on Plasticity and Impact (ISPI 2001) 2001年12月11日